Pemtron's color 3D solder paste inspection (3D SPI) device uses the latest color algorithm to produce images like the actual PCB. 

Our 3D solder paste inspection (3D SPI) device allows for great convenience and accuracy for our customers.

Existing 3D image expresses the height as a color map. 

However, the color 3D solder paste inspection (Color 3D SPI) connects 2D colored images with 3D measuring data to provide detailed and accurate 3D color images, making the operation of equipment much easier.

Key Technologies

  • Fast - 3D high speed inspection with the stripe pattern projection
  • Reliable - 2D / 3D combined inspection Shadow Effect Prevention
  • Accuracy - Automatic zero point setting
  • Precise - Automatic warpage compensation by image recognition
  • Technology - Composite color image processing Patent
  • Ease of Use - Simple inspection recipe management & Programming in 5 minute