The fundamental objective of a dry-film laminator is to intimately bond the dry-film resin and the copper surface of the board, avoiding any air entrapment whatsoever. From a physical standpoint, this can only be correctly performed in the moment that the resin reaches the contact point, in a very fluid/gel like status. The high pressure of hot lamination rolls and a sufficient temperature of the board surface, contributes to a successful lamination process. Pits and scratches on the copper surface can then be totally filled with dry-film as shown in below figure.
Manual laminators are very close to this ideal lamination condition, since in these machines, the dry-film envelops the hot roll for more than a 1/4 of its circumference, maintaining heat and becoming gel like before coming into contact with the board surface. But generally, in the conventional process, boards are not preheated and therefore, the result is not perfect. Refer below figure
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