Wet processing machine SCHMID-GROUP, Germany
- BRUSHING + CLEANING
- LEVELLING + CLEANING
- OXIDE REPLACEMENT
- STRUCTURING + CLEANING
- SURFACE FINISHING
- CHEMICAL MILLING
DESMEAR + METALLIZATION
- DIRECT METALLIZATION
- ELECTROLESS COPPER
- IMMERSION TIN
AUTOMATION + MEASURING EQUIPMENT
- Panel Measuring Table
- Unloader + Loader
- VERTICAL SPRAY PROCESSING EQUIPMENT
Standard Brushing machine
The standard brushing machine is primarily used for the deburring and cleaning of drilled PCBs. Thin inner layers are brushed bi-directionally at a high oscillating frequency. The distance between the brushes and the panel is automatically adjustable. The copper centrifuge "Cecumat" removes the copper abrasion from the rinsing water.
Developing - Etching - Stripping. In a typical inner layer line the non-exposed resist is developed in the developer, the bare copper is sprayed with an acid etching solution in the etching module and removed down to the base material and the resist is stripped off by using an alkaline solution. With outer layers the photo resist is used to define the pattern of an additionally deposited metal resist layer and is removed in the stripper using an alkaline solution.
Strip Etch Strip====SES
Stripping - Etching - Tin stripping. In the production of outer layers, photo resist is used for the structuring of an additional, deposited layer of metal resist, and then removed again in the stripper. The exposed copper is etched off in the alkaline etching module down to the basic material and the metal resist (Sn) is removed in a tin stripping system
ELEctro Plating Line
The galvanic plating system NTwC features a segmented contact frame, which permits contact of the panels only along the side edges and ensures an even copper deposition. During the plating process, the pulse form is controlled by rectifiers. The targeted flooding with fluid jets provides an optimum electrolyte exchange.
Vertical Spray Processing Equipment
Vertical processing has many considerable advantages such as little footprint, a service-friendly design and a contact-free transport system. Most notably vertical processing allows a double-sided symmetric chemistry treatment by identical process conditions on both sides of the substrate.
This is especially beneficial in etching: by using a special chemistry that only is effective when hitting the substrate, the process result is absolutely homogeneous and the well-known puddling effect that occurs in horizontal etching is completely eliminated. Still up to today elaborate intermittent spraying techniques are necessary in trying to compensate this puddling effect.
The Vertical Transport with Clamping (VTwC) is available for all spray applications: precleaning, resist and soldermask developing, flash etching, CuCl etching, resist stripping and MEC etch bond.